Title 1: Analyzing Path Reliability for RIP and EIGRP Protocols in Industrial WAN, (Target: KICS 2019)
1. Finalize Title 1 and create Title 1: Abstract
2. Read and summarize 3D Printing trends for 3D PPT
3. Start Simulation for Title 1
4. Installation of GNS3 Simulation Tool
5. Start Title 1: Introduction
1. Finalize Title 1 Introduction
2. Continue Simulation for Title 1
CAPSTONE DESIGN PROJECT: 3D PRINTING
1. Familiarization of files sent by Conception Company
2. Related papers for trends in 3D Printing
1. Meeting with Conception company
2. 1st PPT Presentation by team leader: Chi Yun
3. Continue studying files from Conception
1. KICS Paper, PPT and Poster
2. Continue learning simulation tools
3. Start new paper for upcoming conferences
1. Journal paper
2. International and Domestic Conferences