Title 1: Path Reliability Analysis for RIP and EIGRP Protocols in Industrial WAN (Target: KICS 2019)
Title 1
1. Finalize Title and Introduction
2. Continue simulation
Title 1
1. Create system model
2. Continue simulation
CAPSTONE DESIGN 2: 3D printer Inspector in Large-Scale Manufacturing Environment
1. 1st PPT Presentation by team leader: Chi Yun
2. Continue studying files from Conception
1. Meeting with Conception company
2. Paper survey
3. PPT Presentation by Gabriel Amaizu
1. KICS Paper, PPT and Poster
2. Continue learning simulation tools
3. Start new paper for upcoming conferences
4. Start familiarizing OPNET
1. Journal paper
2. International and Domestic Conferences