Title 1: Path Reliability Analysis for RIP and EIGRP Protocols in Industrial WAN (Target: KICS 2019)
Title 1:
1. Create system model
2. Continue simulation
Title 1:
1. Continue simulation
2. Finalize results
3. Start PPT and Poster
3D printer Inspector in Large-Scale Manufacturing Environment
1. Meeting with Conception company
2. Paper survey
3. PPT Presentation by Gabriel Amaizu
1. Paper Survey
2. PPT presentation by Danielle Agron
1. Continue learning simulation tools
2. Start new paper for upcoming conferences
3. Start familiarizing OPNET
1. Journal paper
2. International and Domestic Conferences