Made Adi Paramartha Putra
- Title 6: Data Prediction-Based Energy-Efficient Architecture in Industrial Internet of Things - IoT Special Issue (Resubmitted)
- Title 7: Efficient 3D Printer Fault Classification using Multi-Block 2D Convolutional Neural Network - KICS Journal (Accepted)
- Title 8: Composite Multi-Directional LSTM for Accurate Prediction of Energy Consumption - ICOIN (Accepted)
- Title 9: Fault Detection in 3D Printers using an Improved YOLOv5 with Hyperparameter Tuning - KICS Fall 2021 (Accepted)
- Title 10: FDP: A Fog Data Prediction Testbed Architecture to Enhance IoT Sensor Lifetime - ICC (Submitted)
- Title 11: Implementation and Evaluation of Testbed Architecture for IoT Data Prediction - Winter Intensive - IEEE Embedded System Letters
- Title 12: Towards Delay Aware Data Recovery using Deep Learning in Embedded IoT Application - KICS Winter 2022 (Submitted)
- Title 13: Adaptive Data Prediction Protocol for IoT Application - IEEE Journal
Title 6: IEEE IoT Journal
- Waiting for Review
Title 10: ICC 2022
- Waiting for Review
Title 11: IEEE Embedded System Letters
- Monitoring datasets Gathering
- Check missing data filling method
Title 12:KICS Winter 2022
- Testbed evaluation
- Finalize paper
Title 6: IEEE IoT Journal
- Waiting for Review
Title 10: ICC 2022
- Waiting for Review
Title 11: IEEE Embedded System Letters
- Try to create a model based on an open-source dataset
- Create code for the multi-client architecture
- Prepare the second presentation for Winter Intensive
Title 12: KICS Winter 2022
- Paper Submission
3D Printing Monitoring
- Finalize 3D Project with Conception
- Move to Conception to implement testbed implementation
- Evaluate Test Scenario of the system based on project requirement
- Discuss with Conception Engineer
- Create Final Report in Conception
- Finish 3D Project with Conception ( )
- Submit to KICS Winter (✓)
- Present to ICOIN Conference (✓)
- Finish gathering dataset for Winter Intensive ( )
* Accepted in 2 Local and International Conference: ()
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* Accepted in 2 Journal (SCI / SCIE):
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