Made Adi Paramartha Putra
- Title 6: Data Prediction-Based Energy-Efficient Architecture in Industrial Internet of Things - IoT Special Issue (Resubmitted)
- Title 7: Efficient 3D Printer Fault Classification using Multi-Block 2D Convolutional Neural Network - KICS Journal (Accepted)
- Title 8: Composite Multi-Directional LSTM for Accurate Prediction of Energy Consumption - ICOIN (Accepted)
- Title 9: Fault Detection in 3D Printers using an Improved YOLOv5 with Hyperparameter Tuning - KICS Fall 2021 (Accepted)
- Title 10: FDP: A Fog Data Prediction Testbed Architecture to Enhance IoT Sensor Lifetime - ICC (Rejected)(On Revision)
- Title 11: Implementation and Evaluation of Testbed Architecture for IoT Data Prediction - Winter Intensive - IEEE Embedded System Letters
- Title 12: Towards Delay Aware Data Recovery using Deep Learning in Embedded IoT Application - KICS Winter 2022 (Accepted)
- Title 13: Adaptive Data Prediction Protocol for IoT Application - IEEE Journal
Title 6: IEEE IoT Journal
- Waiting for Review
Title 7: KICS Journal (Accepted)
- Working on the final manuscript
- Register for KICS membership
Title 10: ICC 2022
- Make revision and combine it with Winter Intensive
Title 11: IEEE Embedded System Letters
- Finalize the DL model
- Try to design the delay model on socket programming
Title 12: KICS Winter 2022
- Attend KICS Winter 2022 Online
Title 6: IEEE IoT Journal
- Waiting for Review
Title 11: IEEE Embedded System Letters
- Working on device increment
- Client-Server Socket
- Paper writing
3D Printer Monitoring System
- Add new features to the system based on Conception requests
- Add new features to the report
- Transfer knowledge about new features
- Standby if Conception need help about last project details
- Waiting for next project to start
- Finish and submit Winter Intensive Paper ( )
- Create an outline for 3D Printer Monitoring System Journal ( )
- Start working on the next 3D Printer Project ( )
* Accepted in 2 Local and International Conference: ()
- KICS Winter 2022 (✓)
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* Accepted in 2 Journal (SCI / SCIE):
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