Papers

Title 1: Multimodal 3D printer fault classification using Bi-LSTM
- Target: ICT Express

Title 2: Edge AI-based 3D Printer Monitoring and Fault Prediction
- Target: IEEE Transaction on Industrial Electronics

Title 3: Intelligent Fault Classification of 3D Printers Using Long Short-Term Memory
- KICS Winter (Accepted)

Title 4: Machine Learning and Deep Learning Approaches for Intrusion Detection in
-Internet of Things: A Survey
- With Gab and Adi

Title 5: Edge Device Anomaly Detection of 3D Printers using Bidirectional LSTM
- KICS Summer (Accepted)

Title 6: 3D Printer Anomaly Detection and Prediction: A Survey (tentative)
- Target: Summer Intensive

Title 7: (1)Real-World Anomaly Detection by using Digital Twin and Deep Learning with Edge AI-based
---------(2)Digital Twin Enhanced Anomaly Detection for 3D Printer Monitoring with Edge AI-based
-Target: Thesis

Last Week's Progress

Title 1
- Presented to Prof Lee

Title 2
- Discussed the dataset for the project
- Rearrange and change the paper flow

This Week Todo's

Title 1
- Work with the suggestions and comments from Prof Lee
- Improve the accuracy

Title 2
- Continue with the data
- Compare the collected dataset to company data
- Work with paper (sections)

Title 7
- Brainstorming
- Survey papers

Project Progress

3DP Project

Last Week's Project

- Discussed the new project with Prof Lee
- Translated the project document

This Week's Project

- Work with the translated project document
- Team meeting (new project)
- Compared the dataset with existing work

Monthly Goals

1. Learn more about machine learning and deep learning with Python
- Online tutorials
- Re-simulate what I learned
- Apply what I learned to my research

2. Learn about digital twin for my thesis/journal
- Online tutorials
- Journals
- apply what I learned to my research and thesis

2. Journal
- ICT Express Paper (Pr)
- IEEE TIE (Pr)
- Survey Paper (Pr)

Annual Goals

1. Publish two or three conference papers (Domestic/International)
- KICS Winter ✓
- KICS Summer (Submitted)

2. Publish at least one International Journal (SCI/SCIE)
- ICT Express (working on progress)
- IEEE Transaction on Industrial Electronics (working on progress)
- Survey Paper/Dataset collection (working on progress)