Report

Nsl

September 5, 2022 - September 11, 2022

Papers

Title 1: Multimodal 3D printer fault classification using Bi-LSTM
- Target: ICT Express

Title 2: Edge AI-based 3D Printer Monitoring and Fault Prediction
- Target: IEEE Transaction on Industrial Electronics

Title 3: Intelligent Fault Classification of 3D Printers Using Long Short-Term Memory
- KICS Winter (Accepted)

Title 4: Machine Learning and Deep Learning Approaches for Intrusion Detection in
-Internet of Things: A Survey
- With Gab and Adi

Title 5: Edge Device Anomaly Detection of 3D Printers using Bidirectional LSTM
- KICS Summer (Accepted)

Title 6: A Deep Survey on Artificial Intelligence Approaches for 3D Printing Anomaly Detection
- Target: IEEE Transaction on Industrial Electronics (Summer Intensive)

Title 7: (1)Real-World Anomaly Detection using Digital Twin and Deep Learning with Edge AI
---------(2)Digital Twin Enhanced Anomaly Detection for 3D Printer Monitoring with Edge AI
-Target: Thesis

50% Progress
Last Week's Progress

Title 6
- Surveyed ML and DL papers
- Worked with sections IV, V, and future directions

Title 7
- Studied digital twin online
- Surveyed related works

This Week Todo's

Title 6
- Finalizing the paper
- working with ML, DL, and future directions sections

Title 7
- introduction
- Survey-related works
- Work with Jetson nano and3D printer

Project Progress

3DP Project

50% Progress
Last Week's Project

- Work with the dataset
- Discussed the AI algorithm

This Week's Project

- Await for the additional dataset
- Await for the new task

Monthly Goals

1. Learn more about machine learning and deep learning with Python
- Online tutorials
- Re-simulate what I learned
- Apply what I learned to my research

2. Learn about digital twin for my thesis/journal
- Online tutorials
- Journals
- apply what I learned to my research and thesis

2. Journal
- ICT Express Paper (Pr)
- IEEE TIE (Pr)
- Survey Paper (Pr)

Annual Goals

1. Publish two or three conference papers (Domestic/International)
- KICS Winter ✓
- KICS Summer ✓

2. Publish at least one International Journal (SCI/SCIE)
- ICT Express (finalizing)
- IEEE TIE (working on progress)
- Survey Paper (working on progress)oo