Report

Paramartha

September 19, 2022 - September 25, 2022

Papers

Made Adi Paramartha Putra

- Title 6: Data Prediction-Based Energy-Efficient Architecture in Industrial Internet of Things - IEEE Sensors Journal(Submitted)

- Title 7: Efficient 3D Printer Fault Classification using Multi-Block 2D Convolutional Neural Network - KICS Journal (Accepted)

- Title 8: Composite Multi-Directional LSTM for Accurate Prediction of Energy Consumption - ICOIN (Accepted)

- Title 9: Fault Detection in 3D Printers using an Improved YOLOv5 with Hyperparameter Tuning - KICS Fall 2021 (Accepted)

- Title 10: FDP: A Fog Data Prediction Testbed Architecture to Enhance IoT Sensor Lifetime - ICC (Rejected)(On Revision)

- Title 11: FDPR: A Fog Data Prediction and Recovery Algorithm in IoT Networks- Winter Intensive - IEEE Transactions on Industrial Informatics (Submitted)

- Title 12: Towards Delay Aware Data Recovery using Deep Learning in Embedded IoT Application - KICS Winter 2022 (Accepted)

- Title 13: Adaptive Data Prediction Protocol for IoT Application - IEEE Journal

- Title 14: Design and Implementation of 3D Printer Monitoring System for Industries - ICT Express - 3D Printer Project

- Title 15: IDS Survey - with Gabriel and Mark

- Title 16: Time-efficient Sensor Data Prediction using iDC-MLP Algorithm for Industrial IoT - ETFA 2022 -> ICC 2023

- Title 17: 3DFed: A Secure Federated Learning-based System for Fault Detection in 3D Printer Industry - ICTC 2022

- Title 18: ACS: Accuracy-Based Client Selection Mechanism for Federated Industrial IoT - Internet of Things - Summer Intensive 2022

- Title 19: DL-Based AUV Position Prediction Using Odometry Data for Internet of Underwater Things - ICMIC 2022

- Title 20: Hierarchical Federated Transfer Learning for Efficient Fault Detection in Additive Manufacturing - ICC 2023 / IEEE TNSM Special Issue on FL

50% Progress
Last Week's Progress

Title 6: IEEE Sensors Journal
- Follow up on the paper review

Title 16: ETFA
- Follow up on the ETFA withdrawal

Title 17: ICTC 2022
- Start to prepare the presentation material

Title 18: Summer Intensive 2022
- Follow up on the paper review

Title 19: ICMIC 2022
- Start to prepare the presentation material

Title 20: ICC 2023
- Looking for a literature review

This Week Todo's

Title 17: ICTC 2022
- Continue to prepare the presentation material

Title 18: Summer Intensive 2022
- Follow up on the paper review

Title 19: ICMIC 2022
- Continue to prepare the presentation material

Title 20: ICC 2023 / IEEE TNSM
- Create system model
- Implement a transfer learning mechanism

Project Progress

3D Printer Monitoring

50% Progress
Last Week's Project

- Help members to gather sensor and image datasets simultaneously
- Prepare for the next dataset checking

This Week's Project

- Assign tasks for all 3D printer members to validate the dataset
- Validate and check 60% of the dataset and report to Professor Lee

Monthly Goals

- Submit summer intensive 2022 after internal revision (✓)
- Attend ETFA and ICMIC Conference (X)

Annual Goals

Accepted in 2 Local and International Conference: (✓)
- ICOIN 2022 (✓)
- ETFA 2022 (✓)
- KICS Winter 2022 (✓)

* Accepted in 2 Journal (SCI / SCIE):
- Submission to IEEE Sensors Journal (Under Review)
- Submission to IEEE TII (Rejected) -> On Revision for IEEE TNSM Special Issue in Future Networks