Made Adi Paramartha Putra
- Title 6: Data Prediction-Based Energy-Efficient Architecture in Industrial Internet of Things - IEEE Sensors Journal(Submitted)
- Title 7: Efficient 3D Printer Fault Classification using Multi-Block 2D Convolutional Neural Network - KICS Journal (Accepted)
- Title 8: Composite Multi-Directional LSTM for Accurate Prediction of Energy Consumption - ICOIN (Accepted)
- Title 9: Fault Detection in 3D Printers using an Improved YOLOv5 with Hyperparameter Tuning - KICS Fall 2021 (Accepted)
- Title 10: FDP: A Fog Data Prediction Testbed Architecture to Enhance IoT Sensor Lifetime - ICC (Rejected)(On Revision)
- Title 11: FDPR: A Fog Data Prediction and Recovery Algorithm in IoT Networks- Winter Intensive - IEEE Transactions on Industrial Informatics (Submitted)
- Title 12: Towards Delay Aware Data Recovery using Deep Learning in Embedded IoT Application - KICS Winter 2022 (Accepted)
- Title 13: Adaptive Data Prediction Protocol for IoT Application - IEEE Journal
- Title 14: Design and Implementation of 3D Printer Monitoring System for Industries - ICT Express - 3D Printer Project
- Title 15: IDS Survey - with Gabriel and Mark
- Title 16: Time-efficient Sensor Data Prediction using iDC-MLP Algorithm for Industrial IoT - ETFA 2022 -> ICC 2023
- Title 17: 3DFed: A Secure Federated Learning-based System for Fault Detection in 3D Printer Industry - ICTC 2022
- Title 18: ACS: Accuracy-Based Client Selection Mechanism for Federated Industrial IoT - Internet of Things - Summer Intensive 2022
- Title 19: DL-Based AUV Position Prediction Using Odometry Data for Internet of Underwater Things - ICMIC 2022
- Title 20: Hierarchical Federated Transfer Learning for Efficient Fault Detection in Additive Manufacturing - ICC 2023 / IEEE TNSM Special Issue on FL
Title 17: ICTC 2022
- Continue to prepare the presentation material
Title 18: Summer Intensive 2022
- Follow up on the paper review
Title 19: ICMIC 2022
- Continue to prepare the presentation material
Title 20: ICC 2023 / IEEE TNSM
- Create a system model
- Implement a transfer learning mechanism
Title 17: ICTC 2022
- Continue to prepare the presentation material
Title 18: Summer Intensive 2022
- Follow up on the paper review
Title 11: IEEE TII 2022
- Start revising the paper for submission to IEEE TNSM Special Issue of Future Networks
Title 20: ICC 2023 / IEEE TNSM
- Conduct another evaluation rounds
- Writing the paper
- Prepare for paper submission (Due: 30 September 2022)
3D Printer Monitoring
- Assign tasks for all 3D printer members to validate the dataset
- Validate and check 60% of the dataset and report to Professor Lee
- Write a report regarding dataset validation
- Submit summer intensive 2022 after internal revision (✓)
- Attend ETFA and ICMIC Conference (X)
Accepted in 2 Local and International Conference: (✓)
- ICOIN 2022 (✓)
- ETFA 2022 (✓)
- KICS Winter 2022 (✓)
- ICMIC 2022 (✓)
- ICTC 2022 (✓)
* Accepted in 2 Journal (SCI / SCIE):
- Submission to IEEE Sensors Journal (Under Review)
- Submission to IEEE TII (Rejected) -> On Revision for IEEE TNSM Special Issue in Future Networks