Report

Verana

September 26, 2022 - October 2, 2022

Papers

Title 1: Multimodal 3D printer fault classification using Bi-LSTM
- Target: ICT Express

Title 2: Intelligent Fault Classification of 3D Printers Using Long Short-Term Memory
- KICS Winter (Accepted)

Title 3: Machine Learning and Deep Learning Approaches for Intrusion Detection in
-Internet of Things: A Survey
- With Gab and Adi

Title 4: Edge Device Anomaly Detection of 3D Printers using Bidirectional LSTM
- KICS Summer (Accepted)

Title 5: A Survey on Artificial Intelligence Approaches for 3D Printing Anomaly Detection
- Target: IEEE Transaction on Industrial Electronics (Summer Intensive)

Title 7: (1) Real-World Anomaly Detection using Digital Twin and Deep Learning with Edge AI
---------(2) Digital Twin Enhanced Anomaly Detection for 3D Printer Monitoring with Edge AI
-Target: Thesis

50% Progress
Last Week's Progress

Title 6
- Received suggestions and comments from my senior
- Work on the suggestions and comments

Title 7
- Met with Prof Lee and received suggestions and comments
- Worked with the introduction
- Worked with chapter II

This Week Todo's

Title 6
- Work on the suggestions and comments
- Finish revising and submit for approval

Title 7
- Continue working with the chapters
- Implementation
- Paper writing

Project Progress

3DP Project

50% Progress
Last Week's Project

- Received additional dataset
- Validated the dataset

This Week's Project

- Await for the new task from Adi
- Apply or use the dataset for my thesis

Monthly Goals

1. Learn more about machine learning and deep learning with Python
- Online tutorials
- Re-simulate what I learned
- Apply what I learned to my research

2. Learn about digital twin for my journal
- Online tutorials
- Journals
- apply what I learned to my thesis or journal

2. Journal
- ICT Express Paper (Pr)
- IEEE TIE (Pr)
- Survey Paper (Pr)

Annual Goals

1. Publish two or three conference papers (Domestic/International)
- KICS Winter ✓
- KICS Summer ✓
- KICS Fall

2. Publish at least one International Journal (SCI/SCIE)
- ICT Express (finalizing)
- IEEE TIE (working on progress)
- Survey Paper (working on suggestions/comments)