Report

Paramartha

October 24, 2022 - October 30, 2022

Papers

Made Adi Paramartha Putra

- Title 6: Data Prediction-Based Energy-Efficient Architecture in Industrial Internet of Things - IEEE Sensors Journal(Submitted)

- Title 7: Efficient 3D Printer Fault Classification using Multi-Block 2D Convolutional Neural Network - KICS Journal (Accepted)

- Title 8: Composite Multi-Directional LSTM for Accurate Prediction of Energy Consumption - ICOIN (Accepted)

- Title 9: Fault Detection in 3D Printers using an Improved YOLOv5 with Hyperparameter Tuning - KICS Fall 2021 (Accepted)

- Title 10: FDP: A Fog Data Prediction Testbed Architecture to Enhance IoT Sensor Lifetime - ICC (Rejected)(On Revision)

- Title 11: FDPR: A Fog Data Prediction and Recovery Algorithm in IoT Networks- Winter Intensive - IEEE Transactions on Industrial Informatics (Rejected) (On Revision)

- Title 12: Towards Delay Aware Data Recovery using Deep Learning in Embedded IoT Application - KICS Winter 2022 (Accepted)

- Title 13: Adaptive Data Prediction Protocol for IoT Application - IEEE Journal

- Title 14: Design and Implementation of 3D Printer Monitoring System for Industries - ICT Express - 3D Printer Project

- Title 15: IDS Survey - with Gabriel and Mark

- Title 16: Time-efficient Sensor Data Prediction using iDC-MLP Algorithm for Industrial IoT - ETFA 2022 -> ICC 2023 (Submitted)

- Title 17: 3DFed: A Secure Federated Learning-based System for Fault Detection in 3D Printer Industry - ICTC 2022 (Accepted)

- Title 18: ACS: Accuracy-Based Client Selection Mechanism for Federated Industrial IoT - Internet of Things - Summer Intensive 2022 (Minor Revision)

- Title 19: DL-Based AUV Position Prediction Using Odometry Data for Internet of Underwater Things - ICMIC 2022 (Accepted)

- Title 20: Hierarchical Federated Transfer Learning for Efficient Fault Detection in Additive Manufacturing - IEEE TNSM Special Issue on FL (Submitted)

- Title 21: Towards Accuracy-Aware Client Selection in Federated Learning - KICS Fall 2022

- Tile 22: L2-Based Federated Learning for Fast and Secure aggregation in Industrial IoT - ICAIIC 2023

50% Progress
Last Week's Progress

Title 17: ICTC 2022
- Prepare for departure and volunteer

Title 18: Summer Intensive 2022
- Working on Paper Revision
- Finish the simulation part
- Adding the related work section
- Insert more explanation about the proposed ACS algorithm

Title 20: ICC 2023 / IEEE TNSM
- Paper submitted
- Waiting for review comments

Title 21: KICS Fall
- Deploy Simple Smart Contract on Testnet with Brownie: https://goerli.etherscan.io/address/0x3c352ea32dfbb757ccdf4b457e52daf6ecc21917

This Week Todo's

Title 18: Summer Intensive 2022
- Replacing the plot with a new images style
- Add additional explanation about the findings
- Discuss with Professor after finishing the revision

Title 20: ICC 2023 / IEEE TNSM
- Paper submitted
- Waiting for review comments

Title 21: KICS Fall
- Re-write simple idea from Summer Intensive 2022
- Write the paper file (1 of 2 pages)
- Submit paper -> <a href='https://prnt.sc/ewCPQn_vIhSl'> https://prnt.sc/ewCPQn_vIhSl</a>;

Title 22: ICAIIC
- Deploy Data Aggregation Smart Contract on Testnet with Brownie:
<a href='https://goerli.etherscan.io/address/0x2407728e1fe94c26558bdb72baa4d4b16481afe7'> https://goerli.etherscan.io/address/0x2407728e1fe94c26558bdb72baa4d4b16481afe7</a>;

Project Progress

3D Printer Monitoring

50% Progress
Last Week's Project

- Waiting for the new dataset for validation
- Paper writing for the next journal submission
- Help Syifa and Mark with a 3D related things for their Thesis

This Week's Project

- Waiting for the new dataset for validation
- Paper writing for the next journal submission
- Help Syifa and Mark with a 3D related things for their Thesis

Monthly Goals

- Submit Revision for Summer and Winter Intensive (2021) ( )
- Attend ICTC Conference (&#10003;)
- Submit ICC Paper (&#10003;)

Annual Goals

Accepted in 2 Local and International Conference: (&#10003;)
- ICOIN 2022 (&#10003;)
- ETFA 2022 (&#10003;)
- KICS Winter 2022 (&#10003;)
- ICMIC 2022 (&#10003;)
- ICTC 2022 (&#10003;)

* Accepted in 2 Journal (SCI / SCIE):
- Submission to IEEE Sensors Journal (Under Review)
- Submission to the Internet of Things (On Revision)
- Submission to IEEE TII (Rejected) -> On Revision for IEEE TNSM Special Issue in Future Networks