Report

Paramartha

December 5, 2022 - December 11, 2022

Papers

Made Adi Paramartha Putra

- Title 6: Data Prediction-Based Energy-Efficient Architecture in Industrial Internet of Things - IEEE Sensors Journal(Submitted)

- Title 7: Efficient 3D Printer Fault Classification using Multi-Block 2D Convolutional Neural Network - KICS Journal (Accepted)

- Title 8: Composite Multi-Directional LSTM for Accurate Prediction of Energy Consumption - ICOIN (Accepted)

- Title 9: Fault Detection in 3D Printers using an Improved YOLOv5 with Hyperparameter Tuning - KICS Fall 2021 (Accepted)

- Title 10: FDP: A Fog Data Prediction Testbed Architecture to Enhance IoT Sensor Lifetime - ICC (Rejected)(On Revision)

- Title 11: FDPR: A Fog Data Prediction and Recovery Algorithm in IoT Networks- Winter Intensive - IEEE Transactions on Industrial Informatics (Rejected) (On Revision)

- Title 12: Towards Delay Aware Data Recovery using Deep Learning in Embedded IoT Application - KICS Winter 2022 (Accepted)

- Title 13: Adaptive Data Prediction Protocol for IoT Application - IEEE Journal

- Title 14: Design and Implementation of 3D Printer Monitoring System for Industries - ICT Express - 3D Printer Project

- Title 15: IDS Survey - with Gabriel and Mark

- Title 16: Time-efficient Sensor Data Prediction using iDC-MLP Algorithm for Industrial IoT - ETFA 2022 -> ICC 2023 (Submitted)

- Title 17: 3DFed: A Secure Federated Learning-based System for Fault Detection in 3D Printer Industry - ICTC 2022 (Accepted)

- Title 18: ACS: Accuracy-Based Client Selection Mechanism for Federated Industrial IoT - Internet of Things - Summer Intensive 2022 (Minor Revision)

- Title 19: DL-Based AUV Position Prediction Using Odometry Data for Internet of Underwater Things - ICMIC 2022 (Accepted)

- Title 20: Hierarchical Federated Transfer Learning for Efficient Fault Detection in Additive Manufacturing - IEEE TNSM Special Issue on FL (Submitted)

- Title 21: Towards Accuracy-Aware Client Selection in Federated Learning - KICS Fall 2022 (Accepted)

- Title 22: Federated Learning-Enabled Digital Twin for Smart Additive Manufacturing Industry - ICAIIC 2023 (Submitted)

-Title 23: PoA-based Secure Aggregation for FL in Industrial IoT - IoT Journal (Winter Intensive 2023)

50% Progress
Last Week's Progress

Title 18: Summer Intensive 2022
- Waiting for review comments

Title 20: ICC 2023 / IEEE TNSM
- Paper submitted
- Waiting for review comments

Title 22: ICAIIC
- Paper Submitted
- Waiting for review comments

Title 23: IoT Journal
- Design the system model

This Week Todo's

Title 11: Winter Intensive 2022
- Continue to work on the revision
- Search for the next journal submission option

Title 18: Summer Intensive 2022
- Waiting for review comments

Title 20: ICC 2023 / IEEE TNSM
- Paper submitted
- Waiting for review comments

Title 22: ICAIIC
- Paper Submitted
- Waiting for review comments

Title 23: IoT Journal
- Perform simulation work

Project Progress

3D Printer Monitoring & Dataset Validation

50% Progress
Last Week's Project

- Improve the 3D Printer Metaverse Platform (created by: Syifa and Adi)
- Receive new dataset (Total 60,000 images and JSONs)
- Develop a dataset validation program with annotation -> Click Here for <a href='https://github.com/adiparamartha/MADE-iMageAnnotationDatasEtvalidation'> GitHub Repository</a>;

This Week's Project

- Improve the 3D Printer Metaverse Platform (created by: Syifa and Adi)
- Receive new datasets at 20% and 23% (Total 90,000 images and JSONs)
- Develop a dataset validation program with annotation -> Click Here for <a href='https://github.com/adiparamartha/MADE-iMageAnnotationDatasEtvalidation'> GitHub Repository</a>;

Monthly Goals

- Submit Revision for Summer and Winter Intensive (2022) ( )
- Follow up on the Summer Intensive result ( )
- Submit 3D dataset to IEEE Dataport ( )

Annual Goals

Accepted in 2 Local and International Conference: (&#10003;)
- ICOIN 2022 (&#10003;)
- ETFA 2022 (&#10003;)
- KICS Winter 2022 (&#10003;)
- ICMIC 2022 (&#10003;)
- ICTC 2022 (&#10003;)
- KICS FALL 2022 (&#10003;)

* Accepted in 2 Journal (SCI / SCIE):
- Submission to IEEE Sensors Journal (Under Review)
- Submission to the Internet of Things (Minor Revision -> Under Review)
- Submission to IEEE TII (Rejected) -> On Revision for IEEE TNSM Special Issue in Future Networks