Made Adi Paramartha Putra
- Title 6: Data Prediction-Based Energy-Efficient Architecture in Industrial Internet of Things - IEEE Sensors Journal(Submitted)
- Title 7: Efficient 3D Printer Fault Classification using Multi-Block 2D Convolutional Neural Network - KICS Journal (Accepted)
- Title 8: Composite Multi-Directional LSTM for Accurate Prediction of Energy Consumption - ICOIN (Accepted)
- Title 9: Fault Detection in 3D Printers using an Improved YOLOv5 with Hyperparameter Tuning - KICS Fall 2021 (Accepted)
- Title 10: FDP: A Fog Data Prediction Testbed Architecture to Enhance IoT Sensor Lifetime - ICC (Rejected)(On Revision)
- Title 11: FDPR: A Fog Data Prediction and Recovery Algorithm in IoT Networks- Winter Intensive - IEEE Transactions on Industrial Informatics (Rejected) (On Revision)
- Title 12: Towards Delay Aware Data Recovery using Deep Learning in Embedded IoT Application - KICS Winter 2022 (Accepted)
- Title 13: Adaptive Data Prediction Protocol for IoT Application - IEEE Journal
- Title 14: Design and Implementation of 3D Printer Monitoring System for Industries - ICT Express - 3D Printer Project
- Title 15: IDS Survey - with Gabriel and Mark
- Title 16: Time-efficient Sensor Data Prediction using iDC-MLP Algorithm for Industrial IoT - ETFA 2022 -> ICC 2023 (Submitted)
- Title 17: 3DFed: A Secure Federated Learning-based System for Fault Detection in 3D Printer Industry - ICTC 2022 (Accepted)
- Title 18: ACS: Accuracy-Based Client Selection Mechanism for Federated Industrial IoT - Internet of Things - Summer Intensive 2022 (Accepted)
- Title 19: DL-Based AUV Position Prediction Using Odometry Data for Internet of Underwater Things - ICMIC 2022 (Accepted)
- Title 20: Hierarchical Federated Transfer Learning for Efficient Fault Detection in Additive Manufacturing - IEEE TNSM Special Issue on FL (Submitted)
- Title 21: Towards Accuracy-Aware Client Selection in Federated Learning - KICS Fall 2022 (Accepted)
- Title 22: Federated Learning-Enabled Digital Twin for Smart Additive Manufacturing Industry - ICAIIC 2023 (Submitted)
-Title 23: PoA-based Secure Aggregation for FL in Industrial IoT - IoT Journal (Winter Intensive 2023)
Title 11: Winter Intensive 2022
- Continue to work on the revision
- Search for the next journal submission option
Title 18: Summer Intensive 2022
- Waiting for review comments
Title 20: ICC 2023 / IEEE TNSM
- Paper submitted
- Waiting for review comments
Title 22: ICAIIC
- Paper Submitted
- Waiting for review comments
Title 23: IoT Journal
- Perform simulation work
Title 11: Winter Intensive 2022
- Continue to work on the revision
- Search for the next journal submission option
Title 18: Summer Intensive 2022
- Prepare for pre-proof
Title 20: ICC 2023 / IEEE TNSM
- Paper submitted
- Waiting for review comments
Title 22: ICAIIC
- Paper Submitted
- Waiting for review comments
Title 23: IoT Journal
- Perform simulation work
3D Printer Monitoring & Dataset Validation
- Improve the 3D Printer Metaverse Platform (created by: Syifa and Adi)
- Receive new datasets at 20% and 23% (Total 90,000 images and JSONs)
- Develop a dataset validation program with annotation -> Click Here for <a href='https://github.com/adiparamartha/MADE-iMageAnnotationDatasEtvalidation'> GitHub Repository</a>;
- Receive new datasets at 80%
- Develop a dataset validation program with annotation -> Click Here for <a href='https://github.com/adiparamartha/MADE-iMageAnnotationDatasEtvalidation'> GitHub Repository</a>;
-Modify the validation dataset program to handle continuous input. <img src="https://github.com/adiparamartha/MADE-iMageAnnotationDatasEtvalidation/raw/main/app_preview/apps1.png" alt="Girl in a jacket" width="400" height="300">
- Submit Revision for Summer and Winter Intensive (2022) ( )
- Follow up on the Summer Intensive result (✓)
- Submit 3D dataset to IEEE Dataport ( )
Accepted in 2 Local and International Conference: (✓)
- ICOIN 2022 (✓)
- ETFA 2022 (✓)
- KICS Winter 2022 (✓)
- ICMIC 2022 (✓)
- ICTC 2022 (✓)
- KICS FALL 2022 (✓)
* Accepted in 2 Journal (SCI / SCIE):
- Internet of Things Journal Elsevier (✓)
- Submission to IEEE Sensors Journal (Under Review)
- Submission to IEEE TNSM (Under Review)