Made Adi Paramartha Putra
- Title 6: Data Prediction-Based Energy-Efficient Architecture in Industrial Internet of Things - IEEE Sensors Journal(Revision)
- Title 7: Efficient 3D Printer Fault Classification using Multi-Block 2D Convolutional Neural Network - KICS Journal (Accepted)
- Title 8: Composite Multi-Directional LSTM for Accurate Prediction of Energy Consumption - ICOIN (Accepted)
- Title 9: Fault Detection in 3D Printers using an Improved YOLOv5 with Hyperparameter Tuning - KICS Fall 2021 (Accepted)
- Title 10: FDP: A Fog Data Prediction Testbed Architecture to Enhance IoT Sensor Lifetime - ICC (Rejected)(On Revision)
- Title 11: FDPR: A Fog Data Prediction and Recovery Algorithm in IoT Networks- Winter Intensive - IEEE IoT Journal (Under Review)
- Title 12: Towards Delay Aware Data Recovery using Deep Learning in Embedded IoT Application - KICS Winter 2022 (Accepted)
- Title 13: Adaptive Data Prediction Protocol for IoT Application - IEEE Journal
- Title 14: Design and Implementation of 3D Printer Monitoring System for Industries - ICT Express - 3D Printer Project
- Title 15: IDS Survey - with Gabriel and Mark
- Title 16: Time-efficient Sensor Data Prediction using iDC-MLP Algorithm for Industrial IoT - ETFA 2022 -> ICC Workshop 2023 (Submitted)
- Title 17: 3DFed: A Secure Federated Learning-based System for Fault Detection in 3D Printer Industry - ICTC 2022 (Accepted)
- Title 18: ACS: Accuracy-Based Client Selection Mechanism for Federated Industrial IoT - Internet of Things - Summer Intensive 2022 (Accepted)
- Title 19: DL-Based AUV Position Prediction Using Odometry Data for Internet of Underwater Things - ICMIC 2022 (Accepted)
- Title 20: Hierarchical Federated Transfer Learning for Efficient Fault Detection in Additive Manufacturing - IEEE TNSM Special Issue on FL (Rejected -> On Revision)
- Title 21: Towards Accuracy-Aware Client Selection in Federated Learning - KICS Fall 2022 (Accepted)
- Title 22: Federated Learning-Enabled Digital Twin for Smart Additive Manufacturing Industry - ICAIIC 2023 (Accepted)
-Title 23: Three-Stage Optimization for Efficient Federated Learning in Industrial IoT Network - IoT Journal (Under Review)
-Title 24: Select Industrial Internet of Things (IIoT)-Based Fault Mitigation for Smart Additive Manufacturing - IEEE Access (Under Review)
Title 25: ECSM: An Ensembled Client Selection Mechanism for Efficient Federated Learning - THE IEEE INTERNATIONAL CONFERENCE ON INDUSTRY 4.0, ARTIFICIAL INTELLIGENCE, AND COMMUNICATIONS TECHNOLOGY (Ready for Submission)
Title 26: Blockchain-based federated learning for bearing fault detection in the industrial internet of things - Seventh Information Systems International Conference (ISICO 2023) (Ready for Submission)
Title 20: Hierarchical Federated Transfer Learning for Efficient Fault Detection in Additive Manufacturing - IEEE TNSM Special Issue on FL (Rejected -> On Revision)
- Continue to work on the Revision
Title 24: IEEE Access
- Waiting for review
Title 25: THE IEEE INTERNATIONAL CONFERENCE ON INDUSTRY 4.0, ARTIFICIAL INTELLIGENCE, AND COMMUNICATIONS TECHNOLOGY
- Ask Professor's permission to submit
Title 26: Seventh Information Systems International Conference (ISICO 2023)
- Finalize Paper
- Ask Professor's permission to submit
Title 20: Hierarchical Federated Transfer Learning for Efficient Fault Detection in Additive Manufacturing - IEEE TNSM Special Issue on FL (Rejected -> On Revision)
- Continue to work on the Revision
Title 24: IEEE Access
- Waiting for review
Title 25: THE IEEE INTERNATIONAL CONFERENCE ON INDUSTRY 4.0, ARTIFICIAL INTELLIGENCE, AND COMMUNICATIONS TECHNOLOGY
- Ask Professor's permission to submit
Title 26: Seventh Information Systems International Conference (ISICO 2023)
- Finalize Paper
- Ask Professor's permission to submit
Title 6: IEEE Sensors Journal
- Going to review comments
- Prepare for proofread service
Blockchain for Medical IoT
Waiting for leader commands.
Waiting for leader commands.
- Submit one International Conference ()
- Finish the online blockchain course (✓)
- Start to contribute to the blockchain team (✓)
Accepted in 2 Local and International Conference: ()
- ICAIIC (✓)
* Accepted in 2 Journal (SCI / SCIE):
- Submission to IEEE Sensors Journal (Under Review)
- Submission to Elsevier IoT (Under Review)
- Submission to IEEE TNSM (Revise and Resubmit)
- Submission to IEEE IoTJ (Under Review)
- Submission to Elsevier EAAI w/ Syifa (Under Revision - Minor)
- Submission to IEEE JSAC w/ Zai (Under Review)
- Submission to IEEE Access w/ Gino (Under Review)