Title 1: COM-2021-07-0270
(SUBMITTED TO: IET Communications)
Title 2: https://ieeexplore.ieee.org/document/9360448?source=authoralert
(PUBLISHED ON: IEEE Sensors Letters Journal).
Title 3: Sensors-38710-2021
(SUBMITTED TO: IEEE Sensor Journal)
Title 4: https://www.sciencedirect.com/science/article/pii/S0140366421000700
(PUBLISHED ON: Elsevier Computer Communications Journal)
Title 5: TCE-2021-05-0123
(SUBMITTED TO: IEEE Trans. on Consumer Electronics)
Title 6: TCAD-2021-0394
(SUBMITTED TO: IEEE Trans. on CAD)
Title 7: Access-2021-24847
(SUBMITTED TO: IEEE Access)
Title 8: Access-2021-10959
(SUBMITTED TO: IEEE ACCESS)
>>>CONFERENCE LIST<<<
Title 9: IEEE-ICAIIC International Conference, 2021. [PUBLISHED]
Title 10: JCCI, 2021. [PUBLISHED]
Title 11: IEEE-ICTC International Conference 2021. [SUBMITTED]
Title 1: Under review process.
Title 2: Accepted and published.
Title 3: Under review process.
Title 4: Accepted and published.
Title 5: Under review process.
Title 6: Under review process.
Title 7: Under review process.
Title 8: Publication declined on 2020/05/05. Resubmission allowed after Minor revision.
Title 11: Submitted on 7/30/2021. Under review.
COLLABORATIONS WITH Prof. DS Kim:
[1]. Paper survey works in progress.
COLLABORATIONS WITH DR. HOA:
[1]. Paper survey works in progress.
MENTORSHIP/RESEARCH SUPERVISION
[1]. Mr. Damian's Research TITLE [8] above.
[1]. Detailing and investigating all my essential simulation and testbed working tools.
[2]. Working with PostDoc colleagues and NSL Members on current R&D project works.
[1]. At-least two/three SCI/E Journal publications per calendar year.
[2]. Submissions to numerous domestic/international conferences.