>>>JOURNAL LIST<<<
Title 1:
COM-2021-07-0270 [SUBMITTED TO: IET Communications]
Title 2:
[PUBLISHED ON: IEEE Sensors Letters Journal].
Title 3:
Sensors-38710-2021. [SUBMITTED TO: IEEE Sensor Journal]
Title 4:
[PUBLISHED ON: Elsevier Computer Communications Journal]
Title 5:
TCE-2021-05-0123. [SUBMITTED TO: IEEE Trans. on Consumer Electronics]
Title 6:
TCAD-2021-0394. [SUBMITTED TO: IEEE Trans. on CAD]
Title 7:
Access-2021-24847. [SUBMITTED TO: IEEE Access]
Title 8:
Access-2021-10959. [SUBMITTED TO: IEEE ACCESS]
Title 9:
Survey works on combat Avionics.[ON-GOING]. [TARGET: IEEE AES Magazine]
>>>CONFERENCE LIST<<<
Title 10: IEEE-ICAIIC International Conference, 2021. [PUBLISHED]
Title 11: JCCI, 2021. [PUBLISHED]
Title 12: IEEE-ICTC International Conference 2021. [SUBMITTED]
Title 13: IEEE-ICC, 2022 [ON-GOING]
Title [1], [3], [5], [6], and [11]: Under review process.
Title [2] & [4]: Accepted and published.
Title [7]: Publication declined on 2020/08/06.
- Resubmission allowed after Minor revision.
- Re-working the paper based on the comments received.
- To re-submit by 26th Aug.
Title [8]: MENTORSHIP/RESEARCH SUPERVISION
- Publication declined on 2020/05/05.
- Resubmission allowed after Minor revision.
- Reworking the paper with Mr. Damian.
Title [9] & [13]:
- Worked on the system model, algorithms and block diagrams.
- To commence works on simulation and/or testbed soon.
- To submit by end of October 2021.
COLLABORATIONS WITH DR. HOA:
[1]. Paper survey works in progress.
[1]. Detailing and investigating all my essential simulation and testbed working tools.
[2]. Working with PostDoc colleagues and NSL Members on current R&D project works.
[1]. At-least two (2) SCI/E Journal publications per calendar year.
[2]. Submissions to numerous domestic/international conferences.