>>>JOURNAL LIST [Sept. 2021 - Aug. 2022]<<<
Title 1:
Sensors-38710-2021. [IEEE Sensor Journal] [ACCEPTED]
Title 2:
Access-2021-24847. [IEEE Access] [ACCEPTED]
Title 3:
TCE-2021-05-0123. [IEEE Trans. on Consumer Electronics]
Title 4:
TCAD-2021-0394. [IEEE Trans. on CAD]
Title 5:
COM-2021-07-0270 [IET Communications]
Title 6:
Access-2021-10959. [IEEE Access]
Title 7:
Survey works on combat Avionics.[ON-GOING]. [TARGET: IEEE AES Magazine]
>>>CONFERENCE LIST [Sept. 2021 - Aug. 2022]<<<
Title 8: IEEE-ICTC International Conference 2021. [ACCEPTED]
Title 9: IEEE-ICC, 2022 [ON-GOING]
Title 10:IEEE-WCNC, 2022 [SUBMITTED]
Titles [1] & [2]: - ACCEPTED.
- Final manuscript submitted.
- Publications in-progress.
Titles [3], [4] & [5]: - UNDER REVIEW PROCESS.
Title [6]: - MENTORSHIP/RESEARCH SUPERVISION
- Publication declined.
- Resubmission allowed after Major revision.
- Reworking the paper with Mr. Damian.
Title [8]: - IEEE-ICTC, Jeju (ACCEPTED)
- Conference registration and payments done.
- Conference logistics (flight, hotel & PPT slides) in progress.
Title [7] and [9]: - IN-PROGRESS
- Worked on the system model, algorithms and block diagrams.
- To commence works on simulation and/or testbed soon.
Titles [10]: - SUBMITTED on 01/10/2021.
COLLABORATIONS WITH DR. HOA: Paper survey works in progress.
[1]. Detailing and investigating all my essential simulation and testbed working tools.
[2]. Working with PostDoc colleagues and NSL Members on current R&D project works.
[1]. At-least two (2) SCI/E Journal publications per calendar year.
[2]. Submissions to numerous domestic/international conferences.