Weekly Report Detail (Post Doc)

William

April 14, 2022 - April 15, 2022

Papers

Title 1: COM-2021-07-0270 - IET Comm.
Title 2: TCSI-2022-01-0010 - IEEE TC.
Title 3: TNSM-2022-05102 - IEEE TNetw.
Title 4: Survey works on combat Avionics - IEEE Magazine (ON-GOING)
Title 5: Low-Power FACTS for SVCs - IEEE Trans. (ON-GOING)
Title 6: Manuscript ID: 3169 - DASC 2022 (Accepted)
*IEEE-ETFA 2022, and ICTC 2022 (ON-GOING)

Project Progress

Titles [1], [2] & [3]: - UNDER REVIEW PROCESS.

Title [6]: - Accepted for publication.
- Revising Camera-ready manuscript.

Title [4] & [5]: - IN-PROGRESS
- Worked on the system model and block diagrams.
- Simulations and testbed works in progress.
- To finalize and submit by end-of-April.

***COLLABORATIVE RESEARCH WITH DR. T-D HOA:
Paper survey works in progress.

Monthly Goals

[1]. Detailing and investigating all my essential simulation and testbed working tools.
[2]. Working with PostDoc colleagues and NSL Members on current R&D project works.

Annual Goals

ACHIEVEMENTS - [Sept. 2021 - Aug. 2022]:
Title 1: Access-2021-24847. [IEEE Access] [PUBLISHED Sept. 2021].
Title 2: IEEE-ICTC International Conference, [PUBLISHED Dec. 2021]
Title 3: TCAD-2021-0394 [IEEE Transactions on CAD] [PUBLISHED Jan. 2022]
Title 4: Sensors-38710-2021. [IEEE Sensor Journal] [PUBLISHED March 2022]


FURTHER GOALS
[1]. Two (2) SCI/E Journal publications.
[2]. Submissions to numerous domestic/international conferences.