Weekly Report Detail (Post Doc)

William

April 28, 2022 - May 29, 2022

Papers

Title 1: COM-2021-07-0270 - IET Comm.
Title 2: TCSI-2022-01-0010 - IEEE TC.
Title 3: TNSM-2022-05102 - IEEE TNetw.
Title 4: Survey works on combat Avionics - IEEE Magazine (on-going)
Title 5: Low-Power FACTS for SVCs - IEEE Trans. (on-going)
Title 6: Manuscript ID: 3169 - DASC 2022 (Accepted)
Title 7: Time-Frequency based Physical Resource Block (PRB) Sensors for Indoor Radio Frequency Channel Beamforming (Q1: PATENT APPLICATION)

*IEEE-ETFA 2022, and ICTC 2022 (on-going)

Project Progress

Titles [2] & [3]: - (UNDER REVIEW PROCESS).
- Awaiting review comments.

Title [1]: - (IN-REVISION).
- Review comments anticipating major revision was received on April 17th.
- Revising manuscript according to the received review comments.
- Preparing the manuscript for re-submission soon.

Titles [4] & [5]: - (IN-PROGRESS)
- Worked on the system model and block diagrams.
- Simulations and testbed works in progress.
- To finalize and submit by end-of-April.

Title [6]: - (ACCEPTED).
- Camera-ready manuscript is finally revised and to be submitted accordingly.
- Conference registration and payment to follow.


Title [7]: - (PATENT APPLICATION).
- Revising Camera-ready patent manuscript.
- Patent application submission to be completed within April 2022.


***COLLABORATIVE RESEARCH WITH DR. T-D HOA:
Paper survey works in progress.

Monthly Goals

[1]. Detailing and investigating all my essential simulation and testbed working tools.
[2]. Working with PostDoc colleagues and NSL Members on current R&D project works.

Annual Goals

CURRENT ANNUAL ACHIEVEMENTS - [Sept. 2021 - Aug. 2022]:
Title 1: IEEE Access-2021-24847. [IEEE Access] [PUBLISHED Sept. 2021].
Title 2: IEEE-ICTC International Conference, [PUBLISHED Dec. 2021]
Title 3: IEEE TCAD-2021-0394 [IEEE Transactions on CAD] [PUBLISHED Jan. 2022]
Title 4: IEEE Sensors-38710-2021. [IEEE Sensor Journal] [PUBLISHED March 2022]
Title 5: IEEE/AIAA DASC 2022 (ACCEPTED April 2022)


FURTHER ANNUAL GOALS
[1]. Two (2) SCI/E Journal publications.
[2]. Submissions to numerous domestic/international conferences.